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High-Frequency PCB & RF Laminates
Pure Blue SV260-30-H Advanced Copper Clad Laminate Bare Board for RF & 5G Applications
Pure Blue SV260-30-H is a high-performance copper clad laminate bare board engineered to meet the demanding requirements of RF, microwave, and next-generation 4G/5G communication systems. Designed with excellent dielectric stability and low signal loss, this laminate ensures consistent electrical performance even at high frequencies.
Built for precision, reliability, and long-term performance, SV260-30-H offers superior thermal stability, strong copper adhesion, and excellent dimensional control, making it an ideal choice for high-speed, high-frequency PCB designs. Its material characteristics support clean signal transmission, reduced interference, and enhanced efficiency in critical RF environments.
Whether used in base station antennas, wireless communication modules, or advanced RF circuits, Pure Blue SV260-30-H delivers a balanced combination of performance, durability, and manufacturability, helping designers and manufacturers achieve stable, high-quality PCB solutions for modern communication technologies.
Copper Clad Laminate Sheet – Pure Blue SV260-30-H
Copper Clad Laminate Sheet – Pure Blue SV260-30-H
The Pure Blue SV260-30-H copper clad laminate sheet is a polymer-based, double-sided laminate supplied with electro-deposited copper foil on both surfaces. The laminate exhibits a stable dielectric constant (2.60 in X-Y direction and 2.45 in Z direction) and an ultra-low dissipation factor below 0.0008 at 5–10 GHz, ensuring consistent electrical behavior across the sheet.
The material features strong copper adhesion with peel strength ranging from 2.2 to 3.5 N/mm, low moisture absorption below 0.03%, and high electrical insulation properties, including volume and surface resistivity of 10⁷ MΩ·cm. The substrate maintains mechanical integrity within an operating temperature range of –45 °C to +95 °C and has a heat deflection temperature of 95 °C.
Our Product
Our Product
Pure Blue SV260-30-H Copper Clad Laminate Board
Pure Blue SV260-30-H Copper Clad Laminate Board
This image shows a precision-etched RF circuit pattern fabricated on Pure Blue SV260-30-H copper clad laminate. The laminate features a dielectric constant (Dk) of 2.6 and an ultra-low dissipation factor (Df) of 0.0008, enabling stable impedance control and minimal signal loss across high-frequency operation.
The uniform copper distribution and clean trace definition highlight the laminate’s excellent copper adhesion, dimensional stability, and fine-line processing capability. Based on a polymer substrate with electro-deposited copper foil, the board demonstrates consistent electrical behavior and surface quality, making it well suited for high-frequency circuit fabrication where low loss and repeatability are critical.
Our Advantage
Our Advantage
Products & Applications
Products & Applications
Pure Blue SV260-30-H copper clad laminate boards are used in a wide range of high-frequency and low-loss RF products, where stable electrical performance and minimal signal attenuation are critical. Typical products and systems include:
4G / 5G Antenna Arrays and Antenna Panels
RF Front-End Modules
Microwave and RF Signal Distribution Boards
High-Gain Antenna Feed Networks
Wireless Communication Equipment
Base Station and Small Cell RF Circuits
Radar and Microwave Subsystems
Test & Measurement RF Boards
High-Frequency Impedance-Controlled PCBs
Proprietary low loss radome compounds 5G and high end RF ready
We developed super low loss polyolefin based radome injection molding compounds with various UL94 ratings to meet the high-end RF antenna demands.
Proprietary low loss radome compounds 5G and high end RF ready
Proprietary low loss radome compounds 5G and high end RF ready
We developed super low loss polyolefin based radome injection molding compounds with various UL94 ratings to meet the high-end RF antenna demands.
Our UV stabilized and V-2 UL94 rated compounds may have as low dissipation factor (DF) as 0.0023 at 4G cell phone frequencies and only slightly higher DF at the carrier frequencies.
A UV stabilized compound rated to HB UL94 may go down to DF 0.001 or yet better at up to 10 GHz.
For applications where very high tensile strength is required, we may provide a compound measured to deliver 60 to 75 MPa with a somewhat compromised DF due to a heavy reinforcement loading.
Soldering Recommendations
Soldering Recommendations
We strongly recommend reviewing the relevant TDS section before soldering.
Soldering thermoplastic laminate materials (such as PTFE, PET, PE, PP, PC, PPO) is different from soldering FR-4 and other thermoset materials, mainly because heat transfer to the copper must be carefully controlled.
Manual soldering can be performed using any RoHS-compliant solder. The soldering iron should be preheated to 330–350 °C, and the temperature must be verified before use. It is critical to limit the heating time on the solder pad—only the minimum time required to achieve proper solder wetting should be applied.
Applying excessive heat may result in weak solder joints or pad delamination. However, with basic operator training, reliable and repeatable solder joints can be achieved in standard production environments.
Special care is required when soldering rigid or semi-rigid cable ground connections, as these often involve prolonged soldering and higher heat input. To avoid substrate warping, it is recommended to optimize the PCB design in the grounding area. A practical approach is to break large solid copper areas into a dotted or segmented pattern, which helps limit heat spreading across the copper surface.
For best results, we recommend consulting with the technical team when designing cable ground or braid soldering areas.
Etching & PCB Processing
Etching & PCB Processing
Pure Blue laminate products can be processed by qualified PCB manufacturing facilities with appropriate experience and equipment. We have established relationships with several processing partners and plan to share their contact information on our website in the future.
During the current phase, processing house recommendations are provided upon request, and each customer inquiry will be addressed individually in writing.
Our Team -
Our Team -
Nirmesh kumar
Nirmesh kumar
The Founder of the Bandiz Technoz.
Nirmesh Kumar is the Founder and Data Protection Officer (DPO) of Bandiz Technoz Pvt. Ltd., bringing over 22 years of experience across IT infrastructure, cybersecurity, data privacy, and corporate governance. He has worked with leading global organizations including HCLTech, Holtec Consulting, and ETV Network, managing large-scale IT environments and global data centers across the US, Europe, and APAC regions.
With deep expertise in data privacy laws, cybersecurity frameworks, and AI governance, Nirmesh Kumar emphasizes building solutions that are legally compliant, technically robust, and easy to implement. As a certified Data Protection Officer, his leadership philosophy is centered on transparency, zero data-leak operations, and long-term trust with clients, positioning Bandiz Technoz as a reliable partner in data protection and compliance.
Sunil kumar
Sunil kumar
CIO & Head – AI Governance, Privacy, Compliance & Specialist in Copper Clad Laminate (CCL)
Dynamic IT professional with 19+ years of experience driving data excellence and AI governance across Banking, Finance, and Retail domains. As an AI Governance Strategist and ISO 42001 & Data Privacy Lead, I specialize in enabling ethical, secure, and trustworthy AI deployments that align with global compliance standards.
My technical expertise spans Azure Data Engineering (ADF, Synapse, Databricks, Data Lake), SQL Server, Pentaho (Spoon, BI), MSBI, and Power BI/Tableau. I’ve led end-to-end delivery of scalable ETL and BI solutions, large-scale data migrations, and performance-tuned data warehouses that support critical business decisions.
Skilled in Data Warehouse Analysis, Research Analysis, Database Testing, Business Intelligence, Requirements Gathering, and Data Analysis, I bring a strategic mindset and hands-on leadership to every project. I’m passionate about bridging the gap between data engineering and responsible AI, ensuring transparency, fairness, and compliance in every solution
CCLB (Copper Clad Laminate Board).pdfTechnical Data Sheet -
1. Key Technical Advantages
1. Key Technical Advantages
Low Dielectric Constant (DK 2.45–2.60) suitable for RF designs
Ultra-Low Dissipation Factor (<0.0008) for minimal signal loss
Stable performance at 5–10 GHz
Very low moisture absorption (<0.03%)
Strong copper peel strength (2.2–3.5 N/mm)
High dielectric strength (19.7 kV/mm)
Excellent electrical insulation (10⁷ MΩ-cm resistivity)
RoHS & Lead-Free compatible
Semi-flexible polymer-based laminate
Good dimensional stability (low contraction after etching)
Copper Clad Laminate
Performance Strength
Performance Strength
Reliable RF performance in high-frequency applications
Consistent DK stability across in-plane and through-thickness fields
Good adhesion between copper and substrate
Suitable for lightweight RF PCB applications
Stable in humid environments
Predictable behavior during etching and processing
Processing Guidelines (Important)
Processing Guidelines (Important)
Standard FR4 techniques can be used with temperature control
Processing temperature should not exceed 60°C
Drying oven temperature must not exceed 90°C
Roll lamination temperature should not exceed 118°C
Recommended surface finish: Immersion Tin or OSP
Palladium Chloride recommended for plated through holes
Not Recommended / Avoid
Not Recommended / Avoid
Hot Air Leveling (HAL)
Hot tin immersion process
Excessive soldering heat
Prolonged high-temperature exposure above 95°C
Single-side heavy copper removal (may cause warping)
High-temperature automotive or power electronics use
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